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High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

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Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers
  • Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers
  • Buy cheap High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin from wholesalers

High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin

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Brand Name:XCE
Model Number:XCE Bh700
Certification:CE,ROHS,FCC,ISO9008,SGS,UL
Price:Negotiation
Payment Terms:T/T, Western Union
Supply Ability:1000000 pieces per week
Delivery Time:5-10 working days
Company Data
Site Member
Contact Person karen
Business Type: Manufacturer
Officials: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Quality: Quality Certifitation Available
Product Details Company Profile
Product Details

High TG Fr4 Single Sided PCB 94- V0 Electronic Pcb Board With Immersion Tin


Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :11*9cm
5. Permittivity : 2.5
6. Surface finish : Immersion Tin

Features:


FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.


Parameter:


ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2


Description :

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger



Data :

Layer1 to 28 layers
Material typeFR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness0.21mm to 7.0mm
Copper thickness0.5 OZ to 7.0 OZ
Copper thickness in hole>25.0 um (>1mil)

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance


Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
CertificateUL, ISO 9001, ISO 14001
Special requirementsBuried and blind vias+controlled impedance +BGA
ProfilingPunching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.


Benefits:

• High Glass Transition Temperature (Tg) (150Tg or 170Tg)

• High Decomposition Temperature (Td) (> 325º C)

• Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)

• Dielectric Constant (@1 GHz): 4.25-4.55

• Dissipation Factor (@ 1 GHz): 0.016

• UL rated (94V-0, CTI = 4)

• Compatible with standard and lead-free assembly.

• Laminate thickness available from 0.005” to 0.125”

• Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”


Typical Applications:

  • Phase Array Antennas
  • High Reliability Complex Multilayer Circuits
  • Ground Based and Airborne Radar Systems
  • Commercial Airline Collision Avoidance Systems
  • Global Positioning System Antennas
  • Beam Forming Networks

Production Description :

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.












Company Profile

Shenzhen Xinchenger Electronic Co.,Ltd

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

 

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

 

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

 

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

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