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ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

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Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers
  • Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers
  • Buy cheap ROHS PCB Circuit Board Fabrication With Immersion Gold Surface from wholesalers

ROHS PCB Circuit Board Fabrication With Immersion Gold Surface

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Brand Name:XCE
Model Number:XCES
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Price:negotiation
Payment Terms:T/T,Western union
Supply Ability:1, 000, 000 PCS / week
Delivery Time:5-10 days
Company Data
Site Member
Contact Person karen
Business Type: Manufacturer
Officials: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Quality: Quality Certifitation Available
Product Details Company Profile
Product Details

Single Sided PCB Circuit Board Fabrication With Immersion Gold Surface


Quick detail:

Origin:ChinaLine space:5mil
Layer:2Thickness:0.2mm
Surface: ENIGHole:0.8

Parameter:

XCE PCB technical specifications
Annual stock MaterialRogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No.1~16 multilayer pcb
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size508*610mm
Board thickness toleranceT0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress28820Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finishHASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

Files:Gerber,protel,powerpcb,Autocad,etc.

Material:FR-1,FR-4,CEM-1,CEM-3,HI-TG,Aluminum

Layer count:1-24 layers multilayer pcb

Max.Panel Size:450*1500mm

Board Thickness:0.2-5mm

Min. Core Thickness:0.075mm

Cu Thickness:12-140um

Min. Drill Size:0.2mm

Max. Aspect Ratio: 8:1

Min. Trace Width: 0.1mm

Min line spacing:0.075mm

Min. SMT/QFP Pitch:0.4mm


v Fast PCB Fabrication for Samples and Mass Production

v Electronic Components Sourcing Services

v PCBA Assembly Services:SMT,DIP,BGA...

v Function Test

v Stencil,Cable and Enclosure Assembly

v Reverse engineering service

v Standard Packing and On time Delivery


Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • RF Identification (RFID) Tags
  • LNB’s for Direct Broadcast Satellites

Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).

High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.


Features


• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program


ROHS PCB Circuit Board Fabrication With Immersion Gold Surface


Company Profile

Shenzhen Xinchenger Electronic Co.,Ltd

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

 

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

 

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

 

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

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