
High Temperature Tape High Frequency PCB Wireless Rogers 4003 PCB With Bluetooth Moudle
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Layer: 2 Layer
Material: PTFE
Board Thickness: 1.6mm
Surface Treatment: Immersion Gold
Solder Mask: Green
Size:58*159mm
Copper Thickness: 1.0oZ
Min. Line Spacing: 0.25mm
Min Trace Space: 0.25mm
Detailed Terms for Pcb Assembly
We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Rogers PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing.
1. Our professional engineering team can put your project into
production in a short time. Sample pictures and BOM are needed to
make customized products
2. We can supply CAD and Pro-E designed precision moulds. Moulds
can be designed and manufactured according to customers' requests
or samples. Plastic injection processing available.
3. We have advanced equipment for through-hole and SMT DIP COB
cable assembly.
4. ROHS compliant and lead-free process.
5. In-circuit, functional tests& burn-in tests, full system
test
6. High output to guarantee prompt delivery.
We have experience in manufacturing PCB from single layer till 18layers, Nowdays, more and more high fluquency boards are demanded, we have a special department for those field PCBs.
And we have some professional engineers for taking care of those PCBs too. We can provide much lower price than the marcket because of large material ordered by one time. Welcome you join to us.
XCE have the ability of manufacturing many types of specail board. The products are including Rogers, and Teflon Board.
Standard dimension: 490 X 490mm 600 X 500mm (optional dimension for
discussion)
Standard thickness: 1.0, 1.5, 2.0, 3.0 mm(optional dimension for
discussion)
Copper foil thickness: 35um, 70um, 105um, 140um, 210um
Heat conduction and insulating layer thickness: 60um
Specification:
Brand: XCE |
Model: XCEH |
Board size: 58*159MM |
Cu thickness: 35UM |
Material: Rogers |
Min line space&width: 5Mil |
Advantage
High Temperature Tape PCB Board Wireless Rogers 4003 PCB With
Bluetooth Moudle
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical
Inspection),QA/QC,fly porbe ,Etesting
Parameter:
PRODUCT’S DETAILS | |
Raw Material | Rogers |
Layer Count | 2-Layer |
Board Thickness | 1.6mm |
Copper Thickness | 35UM |
Surface Finish | Immerison Silver |
Solder Mask | / |
Silkscreen | / |
Min. Trace Width/Spacing | 0.075/0.075mm |
Min. Hole Size | 0.25mm |
Hole Wall Copper Thickness | ≥20μm |
Measurement | 60*159mm |
Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
Application | Communication,automobile,cell,computer,medical |
Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
We can offer production with high quality and competitive:
Item | Mass Production | Pilot Run Production |
Capacity | Capacity | |
Layer Counts | 1L_18L, HDI | 20-28 , HDI |
Material | FR4 | |
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
FR4+Ro4350 , Rogers3003+FR4 | ||
Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
Board Outline Tolerance | ±0.15mm | ±0.10mm |
Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
Minimum Line / Space | 0.10mm | 0.075mm |
Trace width Tolerance | 15%-20% | 10% |
Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
Minimum laser hole | 0.1mm | 0.075mm |
Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
Mini hole ring (single | 0.075MM | 0.05MM |
OutLayer Copper Thickness | 17um--175um | 175um--210um |
InnerLayer Copper Thickness | 17um--175um | 175um--210um |
Mini Solder Mask Bridge | 0.05mm | 0.025mm |
Impedance Control Tolerance | ±10% | ±5% |
Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
Plated gold , OSP, Carbon ink, | ||
1-2L Lead-time | 3-7 days | 1-2 days |
4- 8L Lead-time | 7-10 days | 2-7 days |
10-18L Lead-time | 10-15 days | 4-9 days |
20-28L Lead-time | 15-20 days | |
Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> |
Parameter
XCE PCB technical specifications | |
Material | Rogers |
Layer No. | 2 |
Min board thickness | 2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
Max panel size | 508*610mm |
Board thickness tolerance | T≥0.8mm±8%.,T<0.8mm±5% |
Wall hole copper thickness | >0.025mm(1mil) |
Finished hole | 0.2mm-6.3mm |
Min line width | 4mil/4mil(0.1/0.1mm) |
Min bonding pad space | 0.1mm(4mil) |
PTH aperture tolerance | ±0.075mm(3mil) |
NPTH aperture tolerance | ±0.05mm(2mil) |
Hole site deviation | ±0.05mm(2mil) |
Profile tolerance | ±0.10mm(4mil) |
Board bend&warp | ≤0.7% |
Insulation resistance | >1012Ωnormal |
Through-hole resistance | <300Ωnormal |
Electric strength | >1.3kv/mm |
Current breakdown | 10A |
Peel strength | 1.4N/mm |
Soldmask regidity | >6H |
Thermal stress | 288℃20Sec |
Testing voltage | 50-300V |
Min buried blind via | 0.2mm(8mil) |
Outer copper thickness | 1oz-5oz |
Inner cooper thickness | 1/2 oz-4oz |
Aspect ratio | 8:1 |
SMT min green oil width | 0.08mm |
Min green oil open window | 0.05mm |
Insulation layer thickless | 0.075mm-5mm |
Taphole aperture | 0.2mm-0.6mm |
Special technology | Indepedance,Blind buried via,thick gold,aluminum PCB |
Surface finish | HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Shenzhen Xinchenger Electronic Co.,Ltd
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.
We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.
Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.
With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.