
2.00mm 8 layers Gold Immersion FR4 High TG PCB
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including
lamination.imersion Gold),we make 1~24layers board in guaranteed
quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness
0.2~7.0mm,copper thickness 1/3~8oz are available )
Parameter:
Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
Copper thickness | 1-6OZ | |||||
Min.Hole size | 0.1mm | |||||
Min.Line Width | 0.1mm | |||||
Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
Solder masker color | green,red,black,white,yellow | |||||
Silkscreen color | black,white,yellow | |||||
Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |||||
Special requirements | Buried and blind vias+controlled impedance +BGA |
Layers | 1-16 layers | Min Board Thickness(2-layer) | 0.2mm |
Max Board Size | 635 × 1100mm | Min Board Thickness(4-layer) | 0.6mm |
Min Board Size | 20 × 30mm | Min Inner-layer Thickness | 0.1mm |
Min Trace | 0.1mm | Min Annular Ring | 0.1mm |
Min Space | 0.1mm | Min Hole Location Tolerance | ±0.075mm |
Min Hole Size | 0.2mm | Min Hole Size Tolerance | ±0.05mm |
Board Warp | ≤ 1° | Min Outer Dimension Tolerance | ±0.1mm |
Solder Mask | Green, Yellow, Red, Black, Blue, White | ||
Surface Finish | HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP | ||
Board Material | FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic | ||
Acceptable file | Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD | ||
CAM software | Genesis, CAM350 |
Rigid PCB Manufacturing Capabilities
Total Pad Size | Standard | Advanced |
Capture Pad | Drill + 0.008 | Drill + 0.006 |
Landing Pad | Drill + 0.008 | Drill + 0.006 |
BC Mechanical Drill (Type III) | 0.008 | 0.006 |
Laser Drill Size | 0.004-0.010 | 0.0025 |
Material Thickness | 0.0035 | 0.0025 |
Stacked Via | Yes | Yes |
Type I Capabilities single & Double Deep | Yes | Yes |
Type II Capabilities Buried Vias with Microvias | Yes | Yes |
Type III Capabilities | Yes | Yes |
Copper Filled Microvia | Yes | Yes |
Smallest Copper Filled Microvia | 0.004 | 0.0025 |
Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 |
Shenzhen Xinchenger Electronic Co.,Ltd
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.
We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.
Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.
With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.