6 Layer Double Sided PCB For Nissan Automotive With FR4 Immersion Gold Surface Finish

6 Layer Double Sided PCB For Nissan Automotive With FR4 Immersion Gold Surface Finish

Quick detail:

• 6 layers
• ENIG
• Trace width space: 3mil/3mil
• For Nissan Automotive
• MOQ: 1pcs

Process Capability:

(1) Drilling: Minimum aperture 0.15MM
(2) metal hole: Minimum aperture 0.15mm, thickness / aperture ratio of 4: 1
(3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate
(4) lead spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate
(5) gold plate: Ni layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements
(6) HASL: tin layer thickness:> or = 2.5-5μ
(7) paneling: Wire-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.2mm Minimum Shape tolerance: ± 0.12mm
(8) outlet chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm
(9) V cut: angle: 30 degrees, 35 degrees, 45 degrees Depth: 2/3 thickness minimum size: 80mm * 80mm
(10) off test:
Resistance to soldering heat: 85 --- 105 ℃ / 280 ℃ --- 360 ℃
Flexible sheet resistance flexing resistance / chemical resistance: full compliance with international standards

Inspection:

1. The main inspection hole metallization quality status, should ensure that the hole was no extra burr, black holes, holes and so on;
2. Check the substrate surface dirt and other unwanted objects;
3. Check the board number, drawing number, process documentation and process description;
4. clarify racking parts, racking requirements and can withstand the plating tank plating area;
5. plating area, the process parameters to be clear, to ensure the stability and viability of the electroplating process parameters;
6. conductive parts cleaning and preparation, the solution was presented first energization process active;
7. finds bath composition is checked, plate surface area status; such as the use of spherical anode bar installed, you must also check the consumption;
8. Check the voltage solid case and the contact area, the current fluctuation range.

Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards.

We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena so on and so forth. Our company's sufficient stocks of hi-frequency pcb materials such as Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers with high quality. Furthermore,we also keen on helping customers shorten the period of production development and 24 hours of sample service is available.

Since the day of company foundation we continuously engaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,high TG, copper substrate,Ceramic substrate PCB. We emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequency researching team to one step ahead of the line of printed circuit board business,we are honored to obtain sound reputations over our worldwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.